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High-Density Arrays

Extreme Performance • Open-Pin Field • Low-Profile

Samtec high-density array connectors feature a variety of pitches, stack heights, and configurations for maximum routing, grounding, and design flexibility.

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Variety of Options
Pitch: 0.635 mm, 0.80 mm, 1.27 mm
Pin/Pair Count: 8 to 500; 1,000+ Roadmap
Stack Height: 4 mm to 40 mm
Options: Right-angle, press-fit tails, 85 Ω tuned, standoffs
Brand/Series Pitch Stack Height Pin Count
NovaRay®
NVAM/NVAF		 0.80 mm x 1.80 mm 7 & 10 mm 8, 12, 16, 24, 32 pairs
AcceleRate® HP
APM6/APF6		 0.635 mm 5 & 10 mm 80, 240, 400
AcceleRate® HD
ADM6/ADF6		 0.635 mm 5 mm 40–400
SEARAY™
SEAM/SEAF		 1.27 mm x 1.27 mm 7–18.5 mm 40–560
SEARAY™ 0.800 mm
SEAM8/SEAF8		 0.80 mm 7 & 10 mm 40–500
LP Array™
LPAM/LPAF		 1.27 mm x 1.27 mm 4, 4.5, 5 mm 40–400
High-Density Arrays Overview

High-Density Arrays Brochure

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NovaRay® 112 Gbps PAM4, Extreme Density Arrays

NovaRay® 112 Gbps PAM4, Extreme Density Arrays

NovaRay® combines extreme density and performance for 112 Gbps PAM4 per channel in 40% less space than traditional arrays.

Features

  • 112 Gbps PAM4 per channel

  • 4.0 Tbps aggregate data rate - 9 IEEE 400G channels

  • PCIe® 6.0/CXL® 3.1 capable

  • Innovative, fully shielded differential pair design enables extremely low crosstalk (beyond 40 GHz) and tight impedance control

  • Two points of contact ensure a more reliable connection

  • 92 Ω solution addresses both 85 Ω and 100 Ω applications

  • Analog Over Array™ capable

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AcceleRate® HP High-Performance Arrays

AcceleRate® HP High-Performance Arrays

AcceleRate® HP 0.635 mm pitch arrays feature 112 Gbps PAM4 extreme performance and a flexible open-pin-field design.

View the full line of AcceleRate® products.

Features

  • 0.635 mm pitch open-pin-field array

  • 56 Gbps NRZ/112 Gbps PAM4 performance

  • Cost optimized solution

  • Low-profile 5 mm and up to 10 mm stack heights

  • Up to 400 total pins available; roadmap to 1,000+ pins

  • Data rate compatible with PCIe® 6.0/CXL® 3.1 and 100 GbE

  • Analog Over Array™ capable

  • View the full line of AcceleRate® products

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AcceleRate® HD Ultra-Dense, Slim Body Arrays

AcceleRate® HD Ultra-Dense, Slim Body Arrays

These 0.635 mm pitch high-density, open-pin-field arrays feature up to 400 high-speed Edge Rate® contacts in a slim, low-profile design.

View the full line of AcceleRate® products.

Features

  • Incredibly dense with up to 400 total I/Os

  • Low profile 5 mm to 16 mm stack heights

  • Slim 5 mm width

  • 4-row design; 10 - 100 positions per row

  • Edge Rate® contact system optimized for signal integrity performance

  • Open-pin-field design for grounding and routing flexibility

  • Supports 64 Gbps PAM4 (32 Gbps NRZ) applications

  • PCIe® 6.0/CXL® 3.1 capable

  • Right-angle and cable in development

  • SureWare™ ultra rugged guide post standoffs available (GPSO)

  • View the full line of AcceleRate® products

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AcceleRate® mP 0.635 mm Signal/Power Arrays

AcceleRate® mP High-Density, High-Speed Signal/Power Arrays

These 0.635 mm pitch high-density, high-speed signal/power arrays achieve 64 Gbps PAM4 speeds and feature rotated power blades for improved performance and simplified breakout region (BOR).

View the full line of AcceleRate® products.

Features

  • Best in class density for power and signal

  • Power blades rotated 90º gives equal access to heat escape for uniform cooling, increased current capacity and reduced crowding

  • Supports 64 Gbps PAM4 (32 Gbps NRZ) applications

  • PCIe® 6.0/CXL® 3.1 capable

  • Open-pin-field design for grounding and routing flexibility

  • High-density multi-row design

  • Low profile 5 mm and 10 mm stack heights; up to 16 mm on roadmap

  • 4 or 8 total power blades; up to 10 in development

  • 60 or 240 total signal positions; additional position counts in development

  • 0.635 mm signal pitch

  • Optional alignment pins

  • Standard weld tabs for a secure connection to the board

  • Polarized guide posts for blind mating

  • View the full line of AcceleRate® products

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SEARAY™

SEARAY™ High-Density Open-Pin-Field Arrays

These high-speed, high-density open-pin-field arrays allow maximum grounding and routing flexibility.

Features

  • Maximum routing and grounding flexibility

  • Lower insertion/extraction forces vs. typical array products

  • 56 Gbps PAM4 performance

  • Up to 560 I/Os in open pin field design

  • 1.27 mm (.050") pitch

  • Rugged Edge Rate® contact system

  • Can be “zippered” during mating/unmating

  • Solder charge terminations for ease of processing

  • Meets Extended Life Product™ (E.L.P.™) standards

  • Analog Over Array™ capable

  • 7–18.5 mm stack heights

  • Vertical, right-angle, press-fit

  • Elevated systems to 40 mm

  • 85 Ω systems

  • Standards: VITA™ 47, VITA™ 57.1 FMC™, VITA™ 57.4 FMC+™, VITA™ 74 VNX™, PISMO™ 2

  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)

  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)

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Additional Information

Additional Features
SeaRay Features

SEARAY™ 0.80 mm

SEARAY™ 0.80 mm Pitch Ultra High-Density Arrays

These 0.80 mm pitch high-density arrays feature an open-pin-field for up to 50% board space savings.

Features

  • 0.80 mm (.0315") pitch grid

  • 50% board space savings versus .050" (1.27 mm) pitch arrays

  • 28 Gbps NRZ/56 Gbps PAM4 performance

  • Rugged Edge Rate® contact system

  • Up to 500 I/Os

  • 7 mm and 10 mm stack heights

  • Solder charge terminations for ease of processing

  • Final Inch® certified for Break Out Region trace routing recommendations

  • Analog Over Array™ capable

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LP Array™

LP Array™ Low Profile Open-Pin-Field High-Density Array

These low profile open-pin-field arrays feature stack heights down to 4 mm with up to 400 total I/Os.

Features

  • 4 mm, 4.5 mm, 5 mm stack heights

  • Up to 400 I/Os

  • 4, 6 and 8 row designs

  • .050" (1.27 mm) pitch

  • Dual beam contact system

  • Solder crimp termination for ease of processing

  • 56 Gbps PAM4 performance

  • Analog Over Array™ capable

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SUPERNOVA™ Low Profile Compression Interposers

SUPERNOVA™ Low Profile Compression Interposers

High-speed, low profile one-piece interposers with a 1.27 mm body height and dual compression contacts.

Features

  • 1.27 mm standard body height

  • 1.00 mm pitch

  • Dual compression contacts

  • 100 – 300 total pins

  • Ideal for low cost board stacking, module-to-board and LGA interfaces

  • Minimizes thermal expansion issues

  • Analog Over Array™ capable

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HD Mezz

HD Mezz Array

Elevated HD Mezz high-density open pin field arrays up to 35 mm stack heights.

Features

  • Application specific capability to stack heights from 20 mm to 35 mm

  • Open pin field design

  • Performance: Up to 9 GHz / 18 Gbps

  • Integrated guide posts to minimize contact damage when mating and unmating

  • Solder charge terminations for ease of processing

  • 2.00 mm x 1.20 mm pitch

  • Up to 299 I/Os

  • Intermateable with Molex HD Mezz Arrays

  • HD Mezz is a trademark of Molex Incorporated

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E.L.P.™ High Mating Cycle Connectors

E.L.P.™ High Mating Cycle Connectors

These high mating cycle connectors are tested to rigorous standards which evaluate contact resistance in simulated storage and field conditions.

Features

  • Passed 10 year Mixed Flowing Gas (MFG)

  • High-mating cycles (250 to 2,500)

  • Variety of high-reliability, rugged contact systems

  • Various connector types and pitches available

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Standoffs, Guide Posts & Hardware

Standoffs, Guide Posts & Hardware

Samtec offers a variety of hardware for connector support, including precision standoffs, compression alignment hardware, and guidance modules to assist with mating and help ensure a reliable connection.

Features

  • Standoffs for 4 mm to 30 mm stack heights

  • Reduces risk for component damage on boards

  • SureWare™ guide post standoffs (GPSO) allow for 0.035" of initial misalignment and assist with "blind mate"

  • Standoffs designed for PCI/104-Express™ and VITA™ standards

  • Guidance modules for ExaMAX® backplane systems

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